HSP-2參數(shù)：THERMAL PAD SNGL PHASE WADHESVE
類(lèi)別：風(fēng)扇，熱管理-熱 - 墊，片其它有關(guān)文件： DeclarationofConformity標(biāo)準(zhǔn)包裝：24系列：HSP應(yīng)用：?jiǎn)蜗郤SR，M50電源模塊形狀：矩形外形：57.15mmx44.45mm厚度：0.005"（0.127mm）材料：-粘合劑：粘合劑-一側(cè)底布，載體：-顏色：黑熱阻率：-導(dǎo)熱率：2.0W/m-K配用：H16WD6025G-10-ND-RELAYSSR25A660VACRANDDCINH16WD6090G-10-ND-RELAYSSR90A660VACRANDDCINH16WD6090G-ND-RELAYSSR90A660VACZERODCINH16WD6075G-10-ND-RELAYSSR75A660VACRANDDCINH16WD6075G-ND-RELAYSSR75A660VACZERODCINH16WD6050G-10-ND-RELAYSSR50A660VACRANDDCINH16WD6050G-ND-RELAYSSR50A660VACZERODCINH16WD6025G-ND-RELAYSSR25A660VACZERODCINCC1881-ND-RELAYSSR90A660VACRANDDCINCC1880-ND-RELAYSSR90A660VACZERODCIN更多...
